US 12,379,410 B2
Chip removing apparatus for repair process of micro-LED display
Inbum Yang, Seoul (KR); Sangsik Jung, Seoul (KR); Junghun Rho, Seoul (KR); and Bongwoon Choi, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 18/041,166
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Aug. 24, 2020, PCT No. PCT/KR2020/011230
§ 371(c)(1), (2) Date Feb. 9, 2023,
PCT Pub. No. WO2022/045376, PCT Pub. Date Mar. 3, 2022.
Prior Publication US 2023/0266379 A1, Aug. 24, 2023
Int. Cl. G01R 31/26 (2020.01); H01L 25/075 (2006.01)
CPC G01R 31/2601 (2013.01) [H01L 25/0753 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A chip removing apparatus for repair process of a micro-LED display, comprising:
a stage unit on which a substrate on which at least one chip is disposed is seated;
a film stage on which an adhesive film is seated to position the adhesive film on the substrate;
a head having a pin for pressing the adhesive film to attach the chip to a lower surface of the adhesive film; and
a head driver configured to move the head,
wherein the film stage includes:
a seating body on which the adhesive film is placed;
an outer ring holder disposed on the seating body configured to secure the adhesive film between an outer ring and the seating body; and
an inner ring configured to provide tension to the adhesive film.