US 12,379,328 B2
Inspection system and inspection method for semiconductor device
Wookjin Lee, Suwon-si (KR); and Ghilgeun Oh, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 7, 2023, as Appl. No. 18/118,350.
Claims priority of application No. 10-2022-0046977 (KR), filed on Apr. 15, 2022.
Prior Publication US 2023/0333027 A1, Oct. 19, 2023
Int. Cl. G01N 21/95 (2006.01); H01L 21/67 (2006.01)
CPC G01N 21/9501 (2013.01) [H01L 21/67248 (2013.01); G01N 2201/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical failure detection system comprising:
a test chamber having an accommodating space therein, the test chamber comprising an upper cover having an opening therein;
a substrate plate provided in the opening of the upper cover, the substrate plate comprising:
a first surface on which a wafer is disposed;
a second surface opposite to the first surface; and
an optical window formed in a central region of the substrate plate and through which the wafer is exposed;
a temperature control device comprising a plurality of thermoelectric devices provided around the optical window of the substrate plate, the temperature control device being configured to heat or cool at least one semiconductor device of the wafer; and
an optical device provided in the accommodating space of the test chamber, the optical device being configured to:
radiate light toward the at least one semiconductor device through the optical window, and
analyze light reflected from the at least one semiconductor device.