	US 12,378,504 B2
	Cleaning solution for removing cerium compound, cleaning method, and method for producing semiconductor wafer
Tomohiro Kusano, Tokyo (JP)
Assigned to Mitsubishi Chemical Corporation, Tokyo (JP)
Filed by Mitsubishi Chemical Corporation, Tokyo (JP)
Filed on Aug. 13, 2021, as Appl. No. 17/445,022.
Application 17/445,022 is a continuation of application No. PCT/JP2020/005988, filed on Feb. 17, 2020.
Claims priority of application No. 2019-027048 (JP), filed on Feb. 19, 2019.
Prior Publication US 2021/0371776 A1, Dec. 2, 2021
Int. Cl. C11D 3/33 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01)

CPC C11D 3/33 (2013.01) [H01L 21/304 (2013.01); H01L 21/3212 (2013.01); C11D 2111/22 (2024.01)]

16 Claims

1. A cleaning solution, consisting of:

an aminopolycarboxylic acid compound having a coordination number of 7 or more;

water;

a pH adjusting agent comprising a quaternary ammonium hydroxide; and

optionally a reducing agent.