	US 12,378,417 B2
	Cured product of resin composition, laminate, and resin composition
Koichiro Nakamura, Kanagawa (JP); and Yuji Hiranuma, Tokyo (JP)
Assigned to NIPPON SHEET GLASS COMPANY, LIMITED, Tokyo (JP)
Filed by Nippon Sheet Glass Company, Limited, Tokyo (JP)
Filed on Jan. 17, 2024, as Appl. No. 18/415,249.
Application 18/415,249 is a continuation of application No. 17/041,775, granted, now 11,912,870, previously published as PCT/JP2019/008152, filed on Mar. 1, 2019.
Claims priority of application No. 2018-061295 (JP), filed on Mar. 28, 2018.
Prior Publication US 2024/0218180 A1, Jul. 4, 2024
Int. Cl. C08G 59/30 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); C08G 59/26 (2006.01); C08G 65/08 (2006.01); C08G 65/18 (2006.01); C08L 83/06 (2006.01)

CPC C08L 83/06 (2013.01) [B32B 27/06 (2013.01); B32B 27/283 (2013.01); B32B 27/38 (2013.01); C08G 59/26 (2013.01); C08G 59/306 (2013.01); C08G 65/08 (2013.01); C08G 65/18 (2013.01); B32B 2250/02 (2013.01); B32B 2363/00 (2013.01); B32B 2383/00 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01)]

9 Claims

1. A laminate comprising:

a substrate; and

a cured product including a silsesquioxane, the cured product being provided on the substrate,

wherein the substrate has an average thermal expansion coefficient αs of 350×10⁻⁶or less [K⁻¹] at 30 to 200° C., the cured product has an average thermal expansion coefficient α1 [K⁻¹] at 30 to 200° C., and αs and α1 satisfy at least one selected from the group consisting of α1/αs≥10 and (α1−αs)²×10⁸≥0.4

the cured product has an infrared absorption spectrum, the absorbance spectrum includes an absorbance Ia derived from a siloxane bond in which two silicon atoms are bonded to one oxygen atom, an absorbance Ib derived from a hydrocarbon group, an absorbance Ic derived from a hydroxyl group, and an absorbance Id derived from an oxetanyl group, and

0.09≤Ia/Ib≤3.0, 0.04≤Ic/Ib≤1.0, and Ia/Id≥45 are satisfied.