	US 12,378,110 B2
	Method of attaching film
Chin-Song Lee, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 26, 2022, as Appl. No. 17/974,481.
Prior Publication US 2024/0140785 A1, May 2, 2024
Int. Cl. B81C 1/00 (2006.01)

CPC B81C 1/00285 (2013.01)

18 Claims

1. A method of attaching a film, comprising:

providing a carrier tape supporting a film over a surface of the carrier tape;

moving the film to a position over an electronic device;

attaching the film to the electronic device;

applying a first pressure on a first region of the film; and

applying a second pressure on a second region of the film, wherein the first pressure is greater than the second pressure.