US 12,377,555 B2
Inclination adjusting device and robot provided with the same
Ippei Shimizu, Kobe (JP); and Yoshiki Maeda, Kobe (JP)
Assigned to KAWASAKI JUKOGYO KABUSHIKI KAISHA, Kobe (JP)
Appl. No. 17/761,206
Filed by Kawasaki Jukogyo Kabushiki Kaisha, Kobe (JP)
PCT Filed Sep. 14, 2020, PCT No. PCT/JP2020/034732
§ 371(c)(1), (2) Date Mar. 17, 2022,
PCT Pub. No. WO2021/054288, PCT Pub. Date Mar. 25, 2021.
Claims priority of application No. 2019-170365 (JP), filed on Sep. 19, 2019.
Prior Publication US 2022/0339795 A1, Oct. 27, 2022
Int. Cl. B25J 15/00 (2006.01); B25J 9/10 (2006.01); B25J 11/00 (2006.01)
CPC B25J 15/0014 (2013.01) [B25J 9/1005 (2013.01); B25J 11/0095 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A robot configured as a part of a semiconductor manufacturing device, and configured to transfer a semiconductor substrate, while holding the semiconductor substrate, the robot comprising:
an inclination adjusting device configured to adjust an inclination of a second structure to a first structure, the first structure constituting a part of the semiconductor manufacturing device and the second structure constituting another part of the semiconductor manufacturing device, the inclination adjusting device including:
the first structure;
the second structure provided opposing to the first structure; and
a spherical surface sliding bearing provided between the first structure and the second structure, wherein
the spherical surface sliding bearing has an inner ring and an outer ring, either one of the inner ring and the outer ring being attached to the first structure, and the other being attached to the second structure,
in the spherical surface sliding bearing, a height adjustment structure intervenes at least either one of between one of the inner ring and the outer ring, and the first structure, and between the other and the second structure,
the height adjustment structure includes:
a motor;
a male threaded structure that is rotated by the motor; and
a female threaded structure that moves in a height direction by rotation of the male threaded structure, and
the female threaded structure is attached to the inner ring;
a blade where a holding position at which the semiconductor substrate is held is defined;
a hold structure configured to hold a base end of the blade; and
a wrist part provided on a base-end side from the hold structure.