US 12,377,519 B2
Substrate processing apparatus and substrate processing method
Nobutaka Fukunaga, Kumamoto (JP); Masakazu Yarimitsu, Kumamoto (JP); Katsuhisa Fujii, Kumamoto (JP); and Hidejiro Ryu, Kumamoto (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/415,756
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Dec. 6, 2019, PCT No. PCT/JP2019/047908
§ 371(c)(1), (2) Date Jun. 18, 2021,
PCT Pub. No. WO2020/129714, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 2018-237690 (JP), filed on Dec. 19, 2018.
Prior Publication US 2022/0080551 A1, Mar. 17, 2022
Int. Cl. B24B 49/04 (2006.01); B24B 7/22 (2006.01); B24B 41/06 (2012.01); B24B 53/017 (2012.01)
CPC B24B 49/04 (2013.01) [B24B 7/226 (2013.01); B24B 41/06 (2013.01); B24B 53/017 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrate is performed;
two connectors, connecting the substrate chuck and the rotary table, configured to linearly move to adjust a tilt angle of the substrate chuck with respect to the rotary table at the processing position;
a spindle shaft including a flange at an end thereof, wherein a whetstone is attached to the flange in a replaceable manner, and the whetstone is configured to thin the substrate at the processing position;
a laser displacement sensor provided at the carry-out position and configured to measure, at multiple points of the substrate in a diametrical direction thereof, a plate thickness of the substrate thinned by the whetstone; and
a controller and a storage including a program, wherein the storage and the program are configured, with the controller, to control the substrate processing apparatus,
wherein the controller is configured to:
control the laser displacement sensor to measure the plate thickness of the substrate, which has been thinned by the whetstone, at the carry-out position;
after measuring the plate thickness of the substrate and before thinning another substrate, control the two connectors to adjust the substrate chuck that holds said another substrate based on a plate thickness measurement result of the substrate; and
control the spindle shaft to thin said another substrate while said another substrate is held by the substrate chuck tilted at the adjusted angle.