US 12,377,516 B2
Polishing head and polishing apparatus
Makoto Kashiwagi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/796,844
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Jan. 7, 2021, PCT No. PCT/JP2021/000326
§ 371(c)(1), (2) Date Aug. 1, 2022,
PCT Pub. No. WO2021/157276, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 2020-018043 (JP), filed on Feb. 5, 2020.
Prior Publication US 2023/0055770 A1, Feb. 23, 2023
Int. Cl. B24B 41/00 (2006.01); B24B 41/047 (2006.01)
CPC B24B 41/002 (2013.01) [B24B 41/047 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A polishing head for polishing a substrate, comprising:
an annular elastic member configured to press a polishing tool against the substrate; and
a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member,
wherein a first portion of the elastic member is inset into the a first fitting groove of the pressing surface, the first portion being in tight contact with the first fitting groove and being out of contact with a region of the pressing surface other than the first fitting groove,
the first portion protrudes from the pressing surface,
the elastic member is put on the pressing-tool body with the elastic member elastically deformed, and
the polishing head the first portion in the first fitting groove is configured to press the polishing tool against the substrate by the first portion.