US 12,377,514 B2
Carrier and method for manufacturing substrate
Tam Dinh Vien, Hanoi (VN)
Assigned to HOYA CORPORATION, Tokyo (JP); and HOYA GLASS DISK VIETNAM LTD., Hanoi (VN)
Appl. No. 17/914,292
Filed by HOYA CORPORATION, Tokyo (JP); and HOYA GLASS DISK VIETNAM LTD., Hanoi (VN)
PCT Filed Mar. 26, 2021, PCT No. PCT/JP2021/013124
§ 371(c)(1), (2) Date Sep. 23, 2022,
PCT Pub. No. WO2021/193970, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 1-2020-01787 (VN), filed on Mar. 26, 2020.
Prior Publication US 2023/0110750 A1, Apr. 13, 2023
Int. Cl. B24B 37/28 (2012.01); B24B 37/08 (2012.01)
CPC B24B 37/28 (2013.01) [B24B 37/08 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A carrier that is provided with a substrate holding hole and is configured to hold a substrate in the substrate holding hole and to be used in processing for polishing or grinding a main surface of the substrate, the carrier comprising:
a plate-shaped carrier main body that has an inner hole and is made of a first material; and
an insertion member that is shaped such that the insertion member fits between the substrate and an inner circumference of the inner hole, that has the substrate holding hole for holding the substrate, and that is made of a second material that is different from the first material,
wherein the insertion member includes a non-protruding portion that has a constant radial width along a circumference of the insertion member and a protrusion portion that protrudes outward from an outer circumference of the non-protruding portion,
a center of gravity of the insertion member is shifted from a center of an inner circumferential shape of the substrate holding hole due to the protrusion portion, and
when a radius of an inscribed circle inscribed to an inner circumference of the substrate holding hole of the insertion member is R, the center of gravity of the insertion member is located 0.1×R or more away from the center of the inner circumferential shape of the substrate holding hole of the insertion member.