US 12,377,501 B2
Solder preform containing Cu—Co particles
Tetsuro Nishimura, Osaka (JP)
Assigned to NIHON SUPERIOR CO., LTD., Osaka (JP)
Appl. No. 17/630,061
Filed by NIHON SUPERIOR CO., LTD., Osaka (JP)
PCT Filed Jul. 22, 2020, PCT No. PCT/JP2020/028578
§ 371(c)(1), (2) Date Jan. 25, 2022,
PCT Pub. No. WO2021/020309, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 2019-138325 (JP), filed on Jul. 26, 2019.
Prior Publication US 2022/0274212 A1, Sep. 1, 2022
Int. Cl. B23K 35/30 (2006.01); B23K 35/26 (2006.01); C22C 9/06 (2006.01)
CPC B23K 35/302 (2013.01) [B23K 35/262 (2013.01); C22C 9/06 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A solder preform comprising:
a lead-free solder mainly comprising Sn, and
metal particles with a melting point higher than a melting point of the lead-free solder, wherein:
the lead-free solder contains Ni,
(Cu,Ni)6 Sn5 is formed on a surface of the metal particles, and
the metal particles consist of Cu—Co, have a Co content of 10 to 40% by mass,
and have an average particle diameter of 5 μm or greater.