US 12,377,484 B2
Quality determination device and quality determination method
Seijiro Hagi, Chiryu (JP); Shinji Naito, Anjo (JP); Takuro Mizukoshi, Okazaki (JP); Sota Sugiura, Hekinan (JP); and Haruya Sakaguchi, Okazaki (JP)
Assigned to FUJI CORPORATION, Chiryu (JP)
Appl. No. 18/548,699
Filed by FUJI CORPORATION, Chiryu (JP)
PCT Filed Mar. 9, 2021, PCT No. PCT/JP2021/009246
§ 371(c)(1), (2) Date Sep. 1, 2023,
PCT Pub. No. WO2022/190200, PCT Pub. Date Sep. 15, 2022.
Prior Publication US 2024/0149363 A1, May 9, 2024
Int. Cl. B23K 3/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01); B23K 101/40 (2006.01)
CPC B23K 3/0623 (2013.01) [B23K 3/08 (2013.01); H05K 13/0465 (2013.01); H05K 13/083 (2018.08); B23K 2101/40 (2018.08)] 14 Claims
OG exemplary drawing
 
1. A quality determination device applied to a component mounter including
a pallet in which supply units are arranged, the supply unit on which a solder ball group that is multiple solder balls to be supplied to a target region that is at least a part of a mounting area of a component to be mounted on a board is mounted, the solder ball group being disposed in accordance with electrode positions of the component, and
a suction nozzle configured to pick up and hold a target object that is the supply unit or the solder ball group mounted on the supply unit and supply the target object to the target region of the board, the quality determination device comprising:
a first determination section configured to determine quality of the solder ball group mounted on at least one supply unit among multiple supply units arranged in the pallet before the suction nozzle picks up the target object.