US 12,377,483 B2
Method of assembling substrate supporting apparatus
Kyu Tae Cho, Pyeongtaek-si (KR)
Assigned to WONIK IPS CO., LTD., Pyeongtaek-si (KR)
Filed by WONIK IPS CO., LTD., Pyeongtaek-si (KR)
Filed on Oct. 12, 2023, as Appl. No. 18/485,874.
Claims priority of application No. 10-2023-0015781 (KR), filed on Feb. 6, 2023.
Prior Publication US 2024/0261882 A1, Aug. 8, 2024
Int. Cl. B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 35/30 (2006.01); B23K 101/36 (2006.01); H02N 13/00 (2006.01)
CPC B23K 1/0016 (2013.01) [B23K 1/20 (2013.01); B23K 35/3013 (2013.01); B23K 2101/36 (2018.08); H02N 13/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of assembling a substrate supporting apparatus, the method comprising:
coupling a conductive rod to an electrode installed in a substrate support provided to support a substrate;
forming a sacrificial layer that surrounds the rod;
bonding the rod and the electrode by melting and infiltrating a filler into a coupling area between the rod and the electrode, while forming a protective layer between the rod and the sacrificial layer by infiltrating the filler into a gap between the rod and the sacrificial layer; and
coupling a shaft to the substrate support, the rod extending through the shaft.