US 12,376,413 B2
Light-emitting module and display apparatus
Min-Hsun Hsieh, Hsinchu (TW); Jen-Chieh Yu, Hsinchu (TW); and Chun-Wei Chen, Hsinchu (TW)
Assigned to EPISTAR CORPORATION, Hsinchu (TW)
Filed by EPISTAR CORPORATION, Hsinchu (TW)
Filed on May 20, 2024, as Appl. No. 18/669,153.
Application 18/669,153 is a continuation of application No. 17/395,641, filed on Aug. 6, 2021, granted, now 11,996,493.
Claims priority of application No. 202010791217.4 (CN), filed on Aug. 7, 2020.
Prior Publication US 2024/0313146 A1, Sep. 19, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H10F 55/15 (2025.01); G09G 3/32 (2016.01); H05B 45/12 (2020.01)
CPC H10F 55/15 (2025.01) [G09G 3/32 (2013.01); H05B 45/12 (2020.01); G09G 2320/0626 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A light-emitting apparatus, comprising:
a carrier;
a first light-emitting module located on the carrier, comprising:
a first circuit substrate, comprising a first surface, a second surface opposite to the first surface, a plurality of first conductive channels arranged on the first surface, and a plurality of first conductive pads arranged on the second surface;
a first light-emitting group arranged on the first surface, and comprising a first red light-emitting diode chip, a first green light-emitting diode chip, and a first blue light-emitting diode chip;
a first electric component disposed on the first surface; and
a first translucent encapsulating component covering the first light-emitting group and the first electric component; and
a second light-emitting module located on the carrier, comprising:
a second circuit substrate, comprising a third surface, a fourth surface opposite to the third surface, a plurality of second conductive channels arranged on the third surface, and a plurality of second conductive pads arranged on the fourth surface;
a second light-emitting group arranged on the third surface, and comprising a second red light-emitting diode chip, a second green light-emitting diode chip, and a second blue light-emitting diode chip;
a second electric component disposed on the third surface; and
a second translucent encapsulating component covering the second light-emitting group and the second electric component;
wherein the first electric component is an infrared light-emitting diode, and the second electric component is an infrared photodiode.