US 12,376,233 B2
Circuit board assembly and radio unit comprising the same
Donghai Yu, Beijing (CN); Pinghua Duan, Nanjing (CN); Qinqin Lu, Nanjing (CN); Peng Liu, Beijing (CN); Yunxuan Ma, Beijing (CN); and Gongao Xu, Beijing (CN)
Assigned to Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
Appl. No. 18/261,294
Filed by Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
PCT Filed Apr. 11, 2021, PCT No. PCT/CN2021/086341
§ 371(c)(1), (2) Date Jul. 13, 2023,
PCT Pub. No. WO2022/217387, PCT Pub. Date Oct. 20, 2022.
Prior Publication US 2024/0080981 A1, Mar. 7, 2024
Int. Cl. H05K 1/14 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/141 (2013.01) [H05K 1/181 (2013.01); H05K 2201/045 (2013.01); H05K 2201/10984 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A circuit board assembly comprising:
a first circuit board and a second circuit board, which are electrically connected with each other; and
a monolithic substrate configured to support a power component and comprising:
a first contact surface that is fixedly connected to and forms a thermal contact with the second circuit board, and
a second contact surface that is fixedly connected to the first circuit board and forms a thermal contact with the first circuit board so that the monolithic substrate functions as an extension of the first circuit board to support the second circuit board.