US 12,376,220 B2
Circuit board structure for mobile PCI express module
Dong-Rui Chan, Taoyuan (TW); Min-Lun Huang, Taoyuan (TW); and Juang-Shin Chen, Taoyuan (TW)
Assigned to ADLINK Technology Inc., Taoyuan (TW)
Filed by ADLINK Technology Inc., Taoyuan (TW)
Filed on Nov. 4, 2022, as Appl. No. 18/052,802.
Claims priority of application No. 110141840 (TW), filed on Nov. 10, 2021.
Prior Publication US 2023/0143791 A1, May 11, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0218 (2013.01) [H05K 1/0216 (2013.01); H05K 1/0243 (2013.01); H05K 1/036 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A circuit board structure for mobile PCI express module applied to conform to PCI Express 4.0 specification, the circuit board structure for mobile PCI express module comprising:
a top signal layer;
a bottom signal layer, located on one side opposite to the top signal layer, wherein the top signal layer and the bottom signal layer both comprising a core and a conductive copper wire respectively, the conductive copper wire being configured on the surface of the core for signal transmission;
at least one power supply layer, configured between the top signal layer and the bottom signal layer;
a plurality of first insulating layers, configured between the top signal layer and the power supply layer and configured between the bottom signal layer and the power supply layer; and
a plurality of second insulating layers, configured between the power supply layer and the first insulating layers;
wherein, the dielectric loss values of the first insulating layers and the second insulating layers are between 0.004 and 0.014 and the length of the conductive copper wire is between 500 and 2500 mil, to reduce the signal loss of the mobile PCI express module less than 8 dB.