US 12,374,776 B2
Encapsulated wireless antenna for reducing the impact of radio frequency interference
Bala Subramanya, Bangalore (IN); Prakash Kurma Raju, Bangalore (IN); Jayprakash Thakur, Bangalore (IN); Zaman Zaid Mulla, Mumbai (IN); Praveen Kumar, Bangalore (IN); Yagnesh Vinodrai Waghela, Bangalore (IN); Maruti Tamrakar, Chhattisgarh (IN); Prasanna Pichumani, Bangalore (IN); and Harry Skinner, Beaverton, OR (US)
Assigned to INTEL CORPORATION, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 31, 2023, as Appl. No. 18/361,952.
Prior Publication US 2025/0046983 A1, Feb. 6, 2025
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/40 (2006.01); H01Q 1/48 (2006.01); H01Q 1/52 (2006.01)
CPC H01Q 1/2266 (2013.01) [H01Q 1/40 (2013.01); H01Q 1/48 (2013.01); H01Q 1/52 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a housing formed from an insulating material;
a metal layer arranged within a cavity of the housing;
an antenna comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity; and
a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.