US 12,374,579 B1
Semiconductor processing equipment
Shipin Yang, Jiangsu (CN)
Assigned to Suzhou Zhicheng Semiconductor Technology Co., Ltd., Kunshan (CN)
Filed by Suzhou Zhicheng Semiconductor Technology Co., Ltd., Jiangsu (CN)
Filed on Dec. 26, 2024, as Appl. No. 19/002,629.
Claims priority of application No. 202410263804.4 (CN), filed on Mar. 8, 2024.
Int. Cl. H01L 21/687 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68785 (2013.01) [H01L 21/67017 (2013.01); H01L 21/68728 (2013.01); H01L 21/68742 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor processing equipment, comprising:
a positioning plate, three clamping column units or more longitudinally penetrating through and rotatably connected to the positioning plate, and a control component driving a plurality of the clamping column units to rotate to clamp or release a wafer, wherein
each of the clamping column unit comprises: an axial center part, a clamping part arranged at top ends of the axial center part, a first sealing ring arranged around outer sides of the axial center part and clamped between the clamping part and the positioning plate, at least two sets of first connecting rods with an equal spacing formed by protruding from ends of the axial center part passing through the positioning plate, and a first elastic component connected to the first connecting rods;
an annular assembly base is axially arranged on an inner side of the positioning plate, and the annular assembly base is configured with second connecting rods longitudinally corresponding to positions of the first connecting rods; two ends of the first elastic component are respectively connected to the first connecting rod and the second connecting rod, to maintain the first elastic component in an initial tensile state, and the first elastic component exerts a longitudinally downward elastic force on the clamping part to clamp the first sealing ring between the clamping part and the positioning plate; and
the clamping column units are configured to switch from a state of clamping the wafer to a state of not clamping the wafer, wherein during the switching, the first connecting rods are simultaneously driven by the axial center part, and the first elastic component is further stretched from the initial tensile state.