US 12,374,499 B2
Multilayer electronic component
Ho Sam Choi, Suwon-si (KR); Kyu Jeong Sim, Suwon-si (KR); Hyo Sung Choi, Suwon-si (KR); Jung Jin Park, Suwon-si (KR); and Jong Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 17, 2023, as Appl. No. 18/198,533.
Claims priority of application No. 10-2022-0172233 (KR), filed on Dec. 12, 2022.
Prior Publication US 2024/0194410 A1, Jun. 13, 2024
Int. Cl. H01G 4/30 (2006.01); C04B 35/626 (2006.01); C04B 35/64 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/6262 (2013.01); C04B 35/64 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on each of both end surfaces of the capacitance forming portion in the first direction; and
an external electrode disposed on the body,
wherein a ratio of an average content of zirconium (Zr) included in the capacitance forming portion to an average content of zirconium (Zr) included in the cover portion satisfies 0.55 or more and 1.00 or less,
wherein an average content of zirconium (Zr) included in the capacitance forming portion satisfies 1073 ppm or more and 1950 ppm or less, and
wherein an average size of dielectric grains included in a central region of the capacitance forming portion is 200 nm or more and 300 nm or less, with a standard deviation that is 100 nm or more and 130 nm or less.