	US 12,372,867 B2
	Photoresists comprising multiple acid generator compounds
James W. Thackeray, Braintree, MA (US); Jin Wuk Sung, Worcester, MA (US); Paul J. LaBeaume, Auburn, MA (US); and Vipul Jain, North Grafton, MA (US)
Assigned to DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC, Marlborough, MA (US)
Filed by Rohm and Haas Electronic Materials LLC, Marlborough, MA (US)
Filed on Sep. 16, 2013, as Appl. No. 14/027,400.
Claims priority of provisional application 61/701,588, filed on Sep. 15, 2012.
Prior Publication US 2014/0080062 A1, Mar. 20, 2014
Int. Cl. G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/20 (2006.01)

CPC G03F 7/0045 (2013.01) [G03F 7/0046 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/20 (2013.01)]

11 Claims

1. A photoresist composition comprising:

(a) a polymer comprising an acid generator bonded thereto; and

(b) an acid generator compound that is not bonded to the polymer and that comprises a thioxanthone moiety or a dibenzothiophene moiety, and one or more acid-labile groups,

wherein the (a) bonded acid generator comprises i) a thioxanthone moiety or a dibenzothiophene moiety, and ii) an acid-labile group;

wherein the (a) bonded acid generator and/or the (b) acid generator compound comprise a sulfonium moiety and/or an iodonium moiety;

wherein the (a) bonded acid generator comprises an anion component covalently bonded to the polymer;

wherein the (a) bonded acid generator does not comprise a cation component covalently bonded to the polymer; and

wherein the acid-labile group of the (b) acid generator compound is on a cation component of the acid generator compound.