US 12,372,101 B1
Fan mounting system
Peng Chianghsieh, Taoyuan (TW); Chi-Ting Yang, New Taipei (TW); and Yu-Shun Chang, Taipei (TW)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Jan. 25, 2024, as Appl. No. 18/422,301.
Int. Cl. F04D 29/64 (2006.01); F04D 19/00 (2006.01); F04D 25/16 (2006.01); F04D 29/52 (2006.01); F04D 29/70 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC F04D 29/646 (2013.01) [F04D 19/002 (2013.01); F04D 25/166 (2013.01); F04D 29/522 (2013.01); F04D 29/703 (2013.01); G06F 1/20 (2013.01); H05K 7/20736 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An information processing system, comprising:
a printed circuit board assembly comprising a plurality of fan connectors;
a chassis configured to receive and support the printed circuit board assembly;
a bracket configured to be coupled with the chassis such that a length dimension of the bracket extends along a width dimension of the chassis; and
a fan module, wherein the fan module comprises:
a fan rotor;
an electrical connector configured to be electrically coupled with a fan connector of the plurality of fan connectors;
a fan housing containing the fan rotor; and
a bracket connector integrally coupled to the fan housing and configured to removably couple the fan module to the bracket at any location out of an infinite set of connection locations along the length dimension of the bracket.