US 12,368,511 B2
Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packages
Brandon C. Marin, Gilbert, AZ (US); Kaveh Hosseini, San Jose, CA (US); Conor O'Keeffe, Cork (IE); and Hiroki Tanaka, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 11, 2020, as Appl. No. 17/119,844.
Prior Publication US 2022/0190918 A1, Jun. 16, 2022
Int. Cl. H04B 10/2581 (2013.01); G02B 27/28 (2006.01); G02F 1/01 (2006.01); G02F 1/09 (2006.01); H04B 10/50 (2013.01); H04B 10/66 (2013.01)
CPC H04B 10/2581 (2013.01) [G02B 27/283 (2013.01); G02F 1/0142 (2021.01); G02F 1/09 (2013.01); H04B 10/50 (2013.01); H04B 10/66 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A photonics device, comprising:
a package substrate, the package substrate comprising a plurality of conductive routing layers;
a photonics die over a first surface of the package substrate;
a multiplexer over a second surface of the package substrate;
a first optical path from the photonics die to the multiplexer for propagating a first optical signal; and
a second optical path from the photonics die to the multiplexer for propagating a second optical signal, wherein a magnetic shell and an optically clear plug filling the magnetic shell is provided along the second optical path to convert the second optical signal from a first mode to a second mode before reaching the multiplexer, wherein the magnetic shell and the optically clear plug are within an opening in the package substrate, the optically clear plug extending from a top of the package substrate to the multiplexer.