US 12,368,081 B2
Electronic package comprising conductive layer connected electrode pad through electronic component
Ho-Chuan Lin, Taichung (TW); Min-Han Chuang, Taichung (TW); and Chia-Chu Lai, Taichung (TW)
Assigned to Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on May 6, 2024, as Appl. No. 18/655,822.
Application 18/215,107 is a division of application No. 17/368,475, filed on Jul. 6, 2021, granted, now 11,728,234, issued on Aug. 15, 2023.
Application 18/655,822 is a continuation of application No. 18/215,107, filed on Jun. 27, 2023, granted, now 12,068,211.
Claims priority of application No. 110116024 (TW), filed on May 4, 2021.
Prior Publication US 2024/0290674 A1, Aug. 29, 2024
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 21/56 (2013.01); H01L 23/5286 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
an encapsulant;
a first electronic component embedded in the encapsulant, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one electrode pad is disposed on the active surface; and
at least one conductive layer provided outside the first electronic component and formed on the first electronic component and embedded in the encapsulant, wherein the at least one conductive layer is free from being formed on the at least one electrode pad, and electronically connects the at least one electrode pad through the first electronic component.