US 12,368,001 B2
Electronic component
Younghun Lee, Suwon-si (KR); Beomjoon Cho, Suwon-si (KR); Gyeong Ju Song, Suwon-si (KR); Won Young Jang, Suwon-si (KR); and Jihong Jo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 3, 2022, as Appl. No. 17/979,973.
Claims priority of application No. 10-2021-0170736 (KR), filed on Dec. 2, 2021.
Prior Publication US 2023/0178299 A1, Jun. 8, 2023
Int. Cl. H01G 2/06 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01)
CPC H01G 2/065 (2013.01) [H01G 4/228 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body; and
a frame terminal having a supporting portion disposed on the external electrode, and a mounting portion disposed at one end of the supporting portion,
wherein the supporting portion has a concave portion spaced apart from the mounting portion, and
the concave portion is an area in which the surface of the supporting portion, facing the multilayer capacitor, is recessed with respect to another portion of the support portion such that a thickness of the concave portion is less than a thickness of the another portion of the support portion.