US 12,366,979 B2
Managing a memory sub-system based on composite temperature
Curtis W. Egan, Brighton, CO (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Oct. 7, 2021, as Appl. No. 17/450,233.
Prior Publication US 2023/0110664 A1, Apr. 13, 2023
Int. Cl. G01K 1/26 (2006.01); G01K 1/02 (2021.01); G01K 3/00 (2006.01); G01K 7/22 (2006.01); G05B 15/02 (2006.01); G06F 3/06 (2006.01)
CPC G06F 3/0632 (2013.01) [G01K 1/026 (2013.01); G01K 3/005 (2013.01); G01K 7/22 (2013.01); G05B 15/02 (2013.01); G06F 3/0604 (2013.01); G06F 3/0673 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
identifying a plurality of device temperature values that are each indicative of a temperature at a respective device of a plurality of devices of a system;
determining, a normalizing value for each device of the plurality of devices based on a corresponding composite temperature threshold ratio; and
determining a largest normalized value among the plurality of devices to be set as a composite temperature of the system.