US 12,366,968 B2
Host device controlled low temperature thermal throttling
Marco Redaelli, Munich (DE)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 16, 2023, as Appl. No. 18/511,343.
Claims priority of provisional application 63/385,438, filed on Nov. 30, 2022.
Prior Publication US 2024/0176498 A1, May 30, 2024
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0614 (2013.01) [G06F 3/0655 (2013.01); G06F 3/0679 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
one or more components configured to:
receive, from a host device, a low temperature thermal throttling command that indicates for the memory device to initiate a thermal throttling operation based on a temperature of the memory device not satisfying a temperature threshold,
wherein the low temperature thermal throttling command indicates an amount of dummy data to be moved from the host device to a particular location of the memory device associated with the thermal throttling operation;
initiate the thermal throttling operation based on receiving the low temperature thermal throttling command,
wherein the one or more components, to initiate the thermal throttling operation, are configured to move the amount of dummy data from the host device to the particular location of the memory device; and
complete the thermal throttling operation based on moving the amount of dummy data from the host device to the particular location of the memory device.