US 12,366,809 B2
Methods and apparatus for controlling a lithographic process
Roy Werkman, Eindhoven (NL); David Frans Simon Deckers, Turnhout (BE); Bijoy Rajasekharan, Eindhoven (NL); Ignacio Salvador Vazquez Rodarte, Eindhoven (NL); and Sarathi Roy, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/424,991
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed Dec. 18, 2019, PCT No. PCT/EP2019/085974
§ 371(c)(1), (2) Date Jul. 22, 2021,
PCT Pub. No. WO2020/156738, PCT Pub. Date Aug. 6, 2020.
Claims priority of application No. 19154087 (EP), filed on Jan. 29, 2019; application No. 19189258 (EP), filed on Jul. 31, 2019; and application No. 19192740 (EP), filed on Aug. 21, 2019.
Prior Publication US 2022/0091514 A1, Mar. 24, 2022
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01); G05B 13/02 (2006.01)
CPC G03F 7/705 (2013.01) [G03F 7/70525 (2013.01); G05B 13/0265 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
obtaining a substrate model for representing a process parameter fingerprint across a substrate, the substrate model being defined as a combination of basis functions including at least one basis function suitable for representing variation of the process parameter fingerprint between substrates and/or batches of substrates;
receiving measurements of the process parameter across at least one substrate;
determining substrate model parameters using the measurements and the basis functions; and
determining a control parameter based on the substrate model parameters and a similarity of the at least one basis function to a process parameter fingerprint variation between substrates and/or batches of substrates.