US 12,366,708 B2
Photonic integrated circuit
Vimal Kumar Kamineni, Fremont, CA (US); Matteo Staffaroni, San Ramon, CA (US); Faraz Najafi, Palo Alto, CA (US); Ann Melnichuk, Rio Rancho, NM (US); George Kovall, Palo Alto, CA (US); and Yong Liang, Niskayuna, NY (US)
Assigned to Psiquantum, Corp., Palo Alto, CA (US)
Filed by Psiquantum, Corp., Palo Alto, CA (US)
Filed on Dec. 15, 2022, as Appl. No. 18/082,520.
Application 18/082,520 is a continuation of application No. PCT/US2021/037422, filed on Jun. 15, 2021.
Claims priority of provisional application 63/039,840, filed on Jun. 16, 2020.
Prior Publication US 2023/0123000 A1, Apr. 20, 2023
Int. Cl. G02B 6/136 (2006.01); G02B 6/122 (2006.01); G02B 6/132 (2006.01)
CPC G02B 6/136 (2013.01) [G02B 6/122 (2013.01); G02B 6/132 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a substrate;
a dielectric layer on the substrate;
a waveguide within the dielectric layer;
a heater disposed in the dielectric layer;
a thermal isolation structure including a trench in the dielectric layer and an undercut in the substrate; and
a photodetector disposed above the waveguide and monolithically integrated with the substrate, the photodetector optically coupled to the waveguide and configured to operate at temperatures below 50 K.