US 12,366,603 B1
Structure and method for testing of PIC with an upturned mirror
Lucas Soldano, San Jose, CA (US); Jing Yang, Singapore (SG); Yong Meng Lee, San Jose, CA (US); and Suresh Venkatesan, San Jose, CA (US)
Assigned to POET Technologies, Inc., Petaluma, CA (US)
Filed by POET Technologies, Inc., Allentown, PA (US)
Filed on Mar. 4, 2024, as Appl. No. 18/594,228.
Application 18/594,228 is a continuation of application No. 17/242,701, filed on Apr. 28, 2021, granted, now 11,921,156.
Int. Cl. G01R 31/311 (2006.01); G01R 31/28 (2006.01)
CPC G01R 31/311 (2013.01) [G01R 31/2884 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising
forming multiple optoelectronic circuits and multiple sacrificial upturned mirrors on a substrate,
wherein each sacrificial upturned mirror of the multiple sacrificial upturned mirrors is optically coupled to an optoelectronic circuit of the multiple optoelectronic circuits,
wherein the sacrificial upturned mirror comprises a reflective layer disposed on a mirror base,
wherein the mirror base comprises a mirror profile configured to provide an optical communication with the optoelectronic circuit;
testing the optoelectronic circuit using the sacrificial upturned mirror,
wherein the testing is performed using a tester comprising an electrical probe head and an optical probe head,
wherein the electrical probe head comprises multiple electrical probes,
wherein the multiple electrical probes are configured to contact multiple terminal pads of the optoelectronic circuit during the testing process,
wherein the optical probe head comprises an optical detector,
wherein the optical detector is configured to be aligned with the sacrificial upturned mirror for receiving an optical signal generated by the optoelectronic circuit during the testing process,
wherein the sacrificial upturned mirror is configured to transmit the optical signal to the optical detector in a direction out of a planar surface of the substrate,
wherein the tester is configured to process the optical signal for testing the optoelectronic circuit;
removing or replacing the sacrificial upturned mirror in a subsequent step after the testing step.