US 12,365,583 B2
Resonance device with substrate having oxide film containing through hole and metal therin, and manufacturing method therefor
Masakazu Fukumitsu, Nagaokakyo (JP); and Yoshiyuki Higuchi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Aug. 13, 2021, as Appl. No. 17/401,744.
Application 17/401,744 is a continuation of application No. PCT/JP2019/040421, filed on Oct. 15, 2019.
Claims priority of application No. 2019-058267 (JP), filed on Mar. 26, 2019.
Prior Publication US 2021/0371273 A1, Dec. 2, 2021
Int. Cl. B81C 1/00 (2006.01); H03H 3/007 (2006.01); H10N 30/00 (2023.01)
CPC B81C 1/00301 (2013.01) [H03H 3/0072 (2013.01); H10N 30/706 (2024.05); B81B 2201/0271 (2013.01); B81B 2207/093 (2013.01); B81B 2207/095 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A resonance device comprising:
a first substrate that includes a resonator;
a second substrate that includes a first oxide film on a surface thereof that faces the first substrate; and
a bonding part that bonds the first substrate and the second substrate to each other so as to seal a vibration space of the resonator,
wherein the first oxide film includes a first through hole along at least part of a periphery of the vibration space when the second substrate is viewed in a plan view of the resonance device, the first through hole penetrating to the surface of the second substrate,
the first through hole includes a first metal therein, and
the first through hole has an annular shape when the second substrate is viewed in the plan view.