US 12,365,582 B2
MEMS resonator integrated cicruit fabrication
Pavan Gupta, Belmont, CA (US); Aaron Partridge, Cupertino, CA (US); and Markus Lutz, Mountain View, CA (US)
Assigned to SiTime Corporation, Santa Clara, CA (US)
Filed by SiTime Corporation, Santa Clara, CA (US)
Filed on Apr. 22, 2024, as Appl. No. 18/641,815.
Application 17/827,437 is a division of application No. 17/143,119, filed on Jan. 6, 2021, granted, now 11,370,656, issued on Jun. 28, 2022.
Application 17/143,119 is a division of application No. 16/903,116, filed on Jun. 16, 2020, granted, now 10,913,655, issued on Feb. 9, 2021.
Application 16/903,116 is a division of application No. 16/372,745, filed on Apr. 2, 2019, granted, now 10,723,617, issued on Jul. 28, 2020.
Application 16/372,745 is a division of application No. 15/805,031, filed on Nov. 6, 2017, granted, now 10,287,162, issued on May 14, 2019.
Application 15/805,031 is a division of application No. 15/187,748, filed on Jun. 20, 2016, granted, now 9,821,998, issued on Nov. 21, 2017.
Application 15/187,748 is a division of application No. 14/597,825, filed on Jan. 15, 2015, granted, now 9,371,221, issued on Jun. 21, 2016.
Application 14/597,825 is a division of application No. 14/191,978, filed on Feb. 27, 2014, granted, now 8,941,247, issued on Jan. 27, 2015.
Application 14/191,978 is a division of application No. 13/681,065, filed on Nov. 19, 2012, granted, now 8,669,664, issued on Mar. 11, 2014.
Application 13/681,065 is a division of application No. 13/151,316, filed on Jun. 2, 2011, granted, now 8,324,729, issued on Dec. 4, 2012.
Application 13/151,316 is a division of application No. 11/763,801, filed on Jun. 15, 2007, granted, now 8,022,554, issued on Sep. 20, 2011.
Application 18/641,815 is a continuation of application No. 18/206,520, filed on Jun. 6, 2023, granted, now 11,987,495.
Application 18/206,520 is a continuation of application No. 17/827,437, filed on May 27, 2022, granted, now 11,708,264, issued on Jul. 25, 2023.
Claims priority of provisional application 60/813,874, filed on Jun. 15, 2006.
Prior Publication US 2025/0019229 A1, Jan. 16, 2025
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H10N 30/30 (2023.01)
CPC B81B 7/0083 (2013.01) [B81B 7/007 (2013.01); B81B 7/0077 (2013.01); B81C 1/0023 (2013.01); B81C 1/00301 (2013.01); B81C 1/00333 (2013.01); B81C 1/00341 (2013.01); H01L 23/34 (2013.01); H01L 23/498 (2013.01); H10N 30/302 (2023.02); B81B 2201/0271 (2013.01); B81B 2207/07 (2013.01); B81B 2207/094 (2013.01); B81C 2201/016 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0154 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method of fabricating an oscillator integrated circuit device, the method comprising:
mounting a first one of a control die or a MEMS resonator die to a lead frame;
depositing a thermally-conductive material;
physically-mounting a second one of the control die or the MEMS resonator die in a stacked relationship with the first one, such that the first one and the second one are physically coupled with each other through the thermally-conductive material;
wherein the method further comprises electrically-coupling the first one with the second one via at least one conductive path; and
wherein the method further comprises encapsulating at least one of the control die or the MEMS resonator die relative to the other, such that the at least one of the control die or the MEMS resonator die and the thermally-conductive material are completely encased relative to an ambient environment which is external to the oscillator integrated circuit.