US 12,365,581 B2
Micromechanical component for a sensor or microphone device
Heribert Weber, Nuertingen (DE); Andreas Scheurle, Leonberg (DE); Joachim Fritz, Tuebingen (DE); Peter Schmollngruber, Aidlingen (DE); Sophielouise Mach, Reutlingen (DE); and Thomas Friedrich, Moessingen-Oeschingen (DE)
Assigned to ROBERT BOSCH GMBH, Stuttgart (DE)
Filed by Robert Bosch GmbH, Stuttgart (DE)
Filed on May 10, 2021, as Appl. No. 17/315,975.
Claims priority of application No. 102020206242.0 (DE), filed on May 18, 2020.
Prior Publication US 2021/0354978 A1, Nov. 18, 2021
Int. Cl. B81B 3/00 (2006.01)
CPC B81B 3/0056 (2013.01) [B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/019 (2013.01); B81B 2203/0307 (2013.01); B81B 2203/0315 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A micromechanical component for a sensor or microphone device, comprising:
a substrate including a substrate surface;
a frame structure which is situated on at least one intermediate layer at least partially covering the substrate surface; and
a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure, in such a way that a diaphragm inner side of the diaphragm abuts the inner volume, the inner volume being hermetically sealed in such a way that the diaphragm is warpable by a pressure difference between an internal pressure present at the diaphragm inner side and an external pressure present at a diaphragm outer side of the diaphragm which is directed away from the diaphragm inner side; and
a bending beam structure which is situated in the inner volume and includes at least one anchoring area, which is attached at the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by a warping of the diaphragm.