US 12,040,311 B1
Substrate debonding from bonded part
Peter D. Brewer, Westlake Village, CA (US); Chia-Ming Chang, Agoura Hills, CA (US); Sevag Terterian, Lake Balboa, CA (US); Charbel Abijaoude, Newbury Park, CA (US); and Diego Eduardo Carrasco, Los Angeles, CA (US)
Assigned to The Boeing Company, Chicago, IL (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Dec. 22, 2022, as Appl. No. 18/145,462.
Int. Cl. B23K 1/00 (2006.01); B23K 1/018 (2006.01); H01L 23/00 (2006.01); B23K 20/02 (2006.01); B23K 101/40 (2006.01)
CPC H01L 24/98 (2013.01) [B23K 1/018 (2013.01); H01L 24/799 (2013.01); B23K 20/026 (2013.01); B23K 2101/40 (2018.08); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/7999 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/98 (2013.01); H01L 2924/35121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for debonding a bonded part comprising:
attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer, wherein:
the bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate;
the third side of the first substrate is opposite the first side; and
the first substrate and the second substrate have different thicknesses;
absorbing a solvent into the adhesive layer;
swelling the adhesive layer in response to the absorbing of the solvent;
bending the first substrate in response to the swelling; and
breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.