US 12,040,245 B2
Circuit board and method for manufacturing electrical connection box including circuit board
Akira Haraguchi, Yokkaichi (JP)
Assigned to AutoNetworks Technologies, Ltd., Yokkaichi (JP); Sumitomo Wiring Systems, Ltd., Yokkaichi (JP); and Sumitomo Electric Industries, Ltd., Osaka (JP)
Appl. No. 17/598,046
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Yokkaichi (JP); SUMITOMO WIRING SYSTEMS, LTD., Yokkaichi (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Jan. 27, 2020, PCT No. PCT/JP2020/002773
§ 371(c)(1), (2) Date Sep. 24, 2021,
PCT Pub. No. WO2020/195104, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-060938 (JP), filed on Mar. 27, 2019.
Prior Publication US 2022/0165636 A1, May 26, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/3185 (2013.01) [H01L 21/56 (2013.01); H01L 25/072 (2013.01); H01L 23/145 (2013.01); H01L 23/538 (2013.01); H01L 24/83 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A circuit board on which an electronic component including a first terminal and a second terminal that are arranged side by side is to be mounted, the circuit board comprising:
an insulating holding member; a conductive plate; and a signal circuit,
wherein the conductive plate is held by the holding member,
the first terminal is joined to the conductive plate,
the signal circuit is formed on a surface of the holding member using conductive nanoink containing a flux, and
an end portion of the signal circuit and the second terminal are joined to each other using solder,
resin molding is carried out on the end portion of the signal circuit and the second terminal that are joined to each other using the solder, and
a coefficient of linear expansion of a resin of the resin molding is smaller than a coefficient of linear expansion of the holding member.