CPC G01R 31/306 (2013.01) [G01R 31/2653 (2013.01); G01R 31/3025 (2013.01)] | 18 Claims |
1. A method comprising:
receiving a recipe for a die included in a wafer, the die being divided into a plurality of tiles, each tile including a registration area and a plurality of non-contact electronic measurement (NCEM)-enabled cells, the recipe including a position for the die within the wafer, a position of the registration area, and a position for each of the NCEM-enabled cell of the plurality of NCEM-enabled cells;
determining an expected position of a registration area included in a tile of the plurality of tiles using the recipe, the wafer being positioned on a movable stage;
determining a parameter of motion of the movable stage using the expected position of the registration area; and
instructing an electron beam column to scan a region of the tile corresponding to the expected position of the registration area using an electron beam while the stage is moving in accordance with the determined parameter.
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