US 11,071,206 B2
Electronic system and processor substrate having an embedded power device module
Danny Clavette, Greene, RI (US)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Oct. 17, 2019, as Appl. No. 16/655,303.
Prior Publication US 2021/0120675 A1, Apr. 22, 2021
Int. Cl. H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/05 (2006.01)
CPC H05K 1/188 (2013.01) [H05K 1/056 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 2201/0221 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic system, comprising:
a board;
a power converter attached to the board and configured to convert an input voltage applied to the board to an intermediate voltage; and
a processor attached to a substrate,
wherein the substrate is attached to the board or seated in a socket attached to the board,
wherein the substrate comprises:
an electrically insulating material having a first main side facing the processor and a second main side facing the board;
a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface between the processor and the board if the substrate is attached to the board, or between the processor and the socket if the substrate is seated in the socket; and
a power device module embedded in the electrically insulating material and configured to convert the intermediate voltage at the second main side to a voltage that is within an operating range of the processor and below a voltage limit of the substrate.