US 11,071,196 B2
Electronic device module and method of manufacturing electronic device module
Kyung Ho Han, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed on Jan. 8, 2020, as Appl. No. 16/737,154.
Claims priority of application No. 10-2019-0040073 (KR), filed on Apr. 5, 2019; and application No. 10-2019-0087794 (KR), filed on Jul. 19, 2019.
Prior Publication US 2020/0323077 A1, Oct. 8, 2020
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01)
CPC H05K 1/0216 (2013.01) [H05K 1/181 (2013.01); H05K 3/0011 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0715 (2013.01)] 22 Claims
OG exemplary drawing
1. An electronic device module, comprising:
a board;
a ground electrode disposed on a first surface of the board;
a sealing portion disposed on the first surface of the board;
electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion;
a first shielding wall connected to the ground electrode and comprising a first side surface disposed along a side surface of the sealing portion;
a shielding layer formed of a conductive material; and
an external sealing portion disposed between the board and a bottom of the shielding layer,
wherein the shielding layer is disposed along a second side surface of the first shielding wall, opposite to the first side surface, is spaced apart from the board, and is disposed along a surface formed by the sealing portion and the first shielding wall.