US 12,364,085 B2
Semiconductor structure and substrate thereof, and manufacturing methods for semiconductor structures and substrates thereof
Kai Cheng, Jiangsu (CN)
Assigned to ENKRIS SEMICONDUCTOR, INC., Jiangsu (CN)
Appl. No. 17/617,737
Filed by ENKRIS SEMICONDUCTOR, INC., Jiangsu (CN)
PCT Filed Jan. 9, 2020, PCT No. PCT/CN2020/071185
§ 371(c)(1), (2) Date Dec. 9, 2021,
PCT Pub. No. WO2021/138873, PCT Pub. Date Jul. 15, 2021.
Prior Publication US 2022/0254975 A1, Aug. 11, 2022
Int. Cl. H01L 33/00 (2010.01); H10H 20/01 (2025.01); H10H 20/812 (2025.01); H10H 20/858 (2025.01)
CPC H10H 20/8581 (2025.01) [H10H 20/01335 (2025.01); H10H 20/812 (2025.01); H10H 20/0365 (2025.01)] 12 Claims
OG exemplary drawing
 
1. A substrate, comprising:
at least one unit region having at least two subunit regions with, at least one groove in each of the at least two subunit regions, and a heat conduction material filled in each of the at least one groove; and in a first unit region of the at least one unit region, the at least two subunit regions have different heat conduction coefficients;
wherein in the first unit region:
(a) the grooves are on at least one of a front surface or a back surface of the substrate; or
(b) the grooves in part of the at least two subunit regions are on the front surface or the back surface of the substrate, and the grooves in another part of the at least two subunit regions are on the front surface and the back surface of the substrate;
wherein in the first unit region, the at least two subunit regions respectively have a same preset porosity, or the preset porosities of the part of the at least two subunit regions are the same, wherein heat conduction materials in the grooves in the at least two subunit regions are different;
wherein in the first unit region, the grooves in the at least two subunit regions are respectively filled with the heat conduction materials with different porosities;
wherein the greater the preset porosity of the subunit region is, the greater the porosity of the heat conduction material in the at least one groove is; and the smaller the preset porosity of the subunit region is, the smaller the porosity of the heat conduction material in the at least one groove is.