US 12,364,069 B2
Method of manufacturing light emitting package structure
Wei-Te Cheng, Taipei (TW); Kuo-Ming Chiu, New Taipei (TW); Kai-Chieh Liang, New Taipei (TW); and Jie-Ting Tsai, New Taipei (TW)
Assigned to LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Changzhou (CN); and LITE-ON TECHNOLOGY CORPORATION, Taipei (TW)
Filed by LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Changzhou (CN); and LITE-ON TECHNOLOGY CORPORATION, Taipei (TW)
Filed on Oct. 21, 2022, as Appl. No. 17/971,528.
Application 17/971,528 is a division of application No. 16/681,970, filed on Nov. 13, 2019, granted, now 11,522,109.
Claims priority of application No. 201811478852.6 (CN), filed on Dec. 5, 2018.
Prior Publication US 2023/0038896 A1, Feb. 9, 2023
Int. Cl. H10H 20/01 (2025.01); H10H 20/85 (2025.01); H10H 20/852 (2025.01)
CPC H10H 20/8506 (2025.01) [H10H 20/852 (2025.01); H10H 20/036 (2025.01); H10H 20/0362 (2025.01)] 13 Claims
OG exemplary drawing
 
1. A method of manufacturing a light emitting package structure including a substrate, a cover element, a light emitting unit and a sealant, an accommodation space being formed between the substrate and the cover element, the light emitting unit being accommodated in the accommodation space, the method comprising:
a preparation process: mounting the light emitting unit on the substrate under an original ambient pressure;
a dispensing process: coating the sealant on a first joint area of the substrate under the original ambient pressure, wherein the sealant has an outer profile;
an cover-enclosing process: disposing the cover element having a second joint area on the substrate under the original ambient pressure, the first joint area and the second joint area being joined to each other by the sealant so as to form the light emitting package structure in a joined status;
a vacuum process: accommodating the light emitting package structure in the joined status into a vacuum chamber, and reducing an ambient pressure in the vacuum chamber to a first pressure by extracting air, wherein the first pressure is lower than the original ambient pressure, the first pressure is maintained for a predetermined time, so that the pressure of the accommodation space approaches the first pressure;
a pressure-adjusting process: adjusting the ambient pressure around the light emitting package structure to a second pressure higher than the first pressure, wherein a pressure difference between the first pressure and the second pressure is between 0.01 and 0.03 MPa, to form a negative pressure environment in the accommodation space of the light emitting package structure, so that at least one side of the outer profile of the sealant forms a recess portion recessed toward the accommodation space, and a depth of the recess portion is greater than or equal to a quarter of a width of the first joint area or the second joint area; and
a curing process: curing the sealant.