US 12,364,039 B2
Photosensitive assembly, camera module and manufacturing methods therefor
Zhongyu Luan, Zhejiang (CN); Zhen Huang, Zhejiang (CN); Li Liu, Zhejiang (CN); Xinxiang Sun, Zhejiang (CN); and Bin Lu, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Appl. No. 17/631,560
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
PCT Filed Jul. 2, 2020, PCT No. PCT/CN2020/099937
§ 371(c)(1), (2) Date Jan. 31, 2022,
PCT Pub. No. WO2021/017746, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 201910709051.4 (CN), filed on Aug. 1, 2019; and application No. 201921236646.4 (CN), filed on Aug. 1, 2019.
Prior Publication US 2022/0278150 A1, Sep. 1, 2022
Int. Cl. H04N 23/54 (2023.01); H04N 23/55 (2023.01); H10F 39/00 (2025.01)
CPC H10F 39/804 (2025.01) [H04N 23/54 (2023.01); H04N 23/55 (2023.01); H10F 39/024 (2025.01)] 14 Claims
OG exemplary drawing
 
1. A photosensitive assembly, characterized in that it comprises:
a circuit board;
a photosensitive chip electrically connected to the circuit board; and
a molded body integrally formed on the circuit board, wherein the molded body has at least one slot formed therein in a recessed manner, and the slot is located outside the photosensitive chip;
wherein the slot is formed in the molded body in a penetrating manner to expose a corresponding area of the circuit board, and the slot is a closed annular slot surrounding a first molded part to divide the molded body into the first molded part and a second molded part independent of each other.