| CPC H10F 39/804 (2025.01) [H01L 23/3171 (2013.01); H01L 23/49822 (2013.01); H10F 39/011 (2025.01); H10F 39/811 (2025.01); H10F 71/00 (2025.01); H10F 77/93 (2025.01)] | 19 Claims |
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1. A device, comprising:
a die including:
a sensor on a first surface of the die;
a first contact pad adjacent to the sensor; and
a second contact pad spaced further from the sensor than the first contact pad;
a transparent layer on the first surface of the die, the transparent layer having:
an exterior facing surface opposite the first surface of the die; and
a first sidewall transverse the exterior facing surface;
a molding compound around the die and the transparent layer, the molding compound having an outer surface that is further from the sensor than the exterior facing surface of the transparent layer, the first sidewall of the transparent layer contacting the molding compound;
a non-conductive layer including a plurality of stacked non-conductive layers, the non-conductive layer having:
a second surface coplanar with the molding compound;
a third surface coplanar with the transparent layer;
a fourth surface opposite the second and third surfaces;
a first thickness between the second and fourth surfaces; and
a second thickness between the third and fourth surfaces, the first thickness is less than the second thickness; and
a conductive structure extending from the second contact pad through the transparent layer to the non-conductive layer.
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