US 12,363,869 B2
Heat dissipation device
Abbas Ali, New Taipei (TW); Bin-Wei Goh, New Taipei (TW); and Shao-Chien Lu, New Taipei (TW)
Assigned to NIDEC CHAUN-CHOUNGTECHNOLOGY CORPORATION, New Taipei (TW)
Filed by NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION, New Taipei (TW)
Filed on Aug. 15, 2023, as Appl. No. 18/234,312.
Prior Publication US 2025/0063695 A1, Feb. 20, 2025
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20409 (2013.01) [H05K 7/20145 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
a thermal conductive substrate;
a plurality of heat dissipation fins, spacedly stacked on the thermal conductive substrate, and a configuration space defined between the heat dissipation fins; and
at least one insulation guiding component, disposed in the configuration space, and comprising a bottom portion, two sides upwardly extended from the bottom portion, and a channel collectively enclosed by the bottom portion and the two sides;
wherein, a width of the channel is at least greater than a spacing between any two heat dissipation fins adjacent to each other.