US 12,362,502 B1
Boundary choke between modules in phased array antennas
Peter James Hetzel, Seattle, WA (US)
Assigned to Amazon Technologies, Inc., Seattle, WA (US)
Filed by Amazon Technologies, Inc., Seattle, WA (US)
Filed on May 14, 2024, as Appl. No. 18/664,006.
Application 18/664,006 is a continuation of application No. 17/742,323, filed on May 11, 2022, granted, now 11,996,621.
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 21/06 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01); H04B 1/10 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/422 (2013.01); H04B 1/1018 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An array of antenna modules, the array comprising:
a first antenna module; and
a second antenna module, wherein a physical distance between a first edge of the first antenna module and a second edge of the second antenna module causes standing resonant fields between the first antenna module and the second antenna module, wherein the first antenna module comprises:
a circuit board comprising a first set of conducting layers interleaved with a first set of insulating layers;
a first antenna element disposed on a first surface of the circuit board;
a first via coupled to the first antenna element, the first via extending between the first surface of the circuit board and a second surface of the circuit board, wherein the first via is located at a first distance from the first edge; and
a radio frequency (RF) choke located along a first axis parallel to the first edge and at a second distance from the first edge, the second distance being less than the first distance and corresponding to a quarter wavelength of an operating frequency of the first antenna element, wherein the RF choke comprises a first set of vias each disposed within a first insulating layer of the first set of insulating layers, and wherein the RF choke causes a reduction in the standing resonant fields.