US 12,362,275 B2
Method of fabricating package structure including a plurality of antenna patterns
Sen-Kuei Hsu, Kaohsiung (TW); Hsin-Yu Pan, Taipei (TW); and Yi-Che Chiang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 23, 2024, as Appl. No. 18/672,001.
Application 18/672,001 is a continuation of application No. 17/870,798, filed on Jul. 21, 2022, granted, now 12,021,024.
Application 17/870,798 is a continuation of application No. 17/079,525, filed on Oct. 26, 2020, granted, now 11,444,023, issued on Sep. 13, 2022.
Application 17/079,525 is a continuation of application No. 16/262,924, filed on Jan. 31, 2019, granted, now 10,818,588, issued on Oct. 27, 2020.
Prior Publication US 2024/0312904 A1, Sep. 19, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/522 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 21/4871 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 23/5283 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/73253 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
forming a first redistribution layer on a conductive carrier, wherein the first redistribution layer is physically and electrically connected to the conductive carrier;
forming a semiconductor die on the first redistribution layer;
forming a second redistribution layer on the semiconductor die, wherein the second redistribution layer is electrically connected to the semiconductor die and the first redistribution layer;
removing portions of the conductive carrier to form a conductive base and a plurality of antenna patterns, wherein the plurality of antenna patterns is electrically connected to a feed line and is electrically coupled to a ground plate of the first redistribution layer.