US 12,362,267 B2
Electronic package and method for manufacturing an electronic package
Hoang Mong Nguyen; Anthony James LoBianco, Irvine, CA (US); Howard E. Chen, Anaheim, CA (US); Ki Wook Lee, Irvine, CA (US); and Yi Liu, San Diego, CA (US)
Assigned to SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Oct. 19, 2021, as Appl. No. 17/504,911.
Claims priority of provisional application 63/255,187, filed on Oct. 13, 2021.
Prior Publication US 2023/0115846 A1, Apr. 13, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49866 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a substrate having a first side and a second side, the substrate configured to receive one or more electronic components;
a first electronic component mounted to the first side of the substrate;
a first mold structure extending over at least part of the first side of the substrate; and
a group of through-mold connections provided on the first side of the substrate, the group of through-mold connections substantially formed of a non-reflowable electrically conductive material, the first mold structure substantially encapsulating the group of through-mold connections, the group of through-mold connections exposed through the first mold structure and including first and second sub-groups of through-mold connections, the second sub-group surrounding the first electronic component and the first sub-group surrounding the second sub-group, and each through-mold connection of the group of through-mold connections being individually recessed in a corresponding well defined in the first mold structure such that an exposed surface of the through-mold connection is recessed offset from a surface of the first mold structure that surrounds the through-mold connection by a depth and is exposed by the corresponding well to define the exposed surface.