US 12,362,256 B2
Method for forming semiconductor package structure
Po-Chen Lai, Hsinchu County (TW); Ming-Chih Yew, Hsinchu (TW); Po-Yao Lin, Zhudong Township, Hsinchu County (TW); Chin-Hua Wang, New Taipei (TW); and Shin-Puu Jeng, Po-Shan Village (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 10, 2024, as Appl. No. 18/631,181.
Application 18/631,181 is a division of application No. 17/527,831, filed on Nov. 16, 2021, granted, now 11,984,381.
Claims priority of provisional application 63/188,106, filed on May 13, 2021.
Prior Publication US 2024/0258193 A1, Aug. 1, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 23/433 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4817 (2013.01); H01L 23/49833 (2013.01); H01L 25/0655 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H01L 23/49816 (2013.01); H01L 24/73 (2013.01); H01L 2924/1611 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a semiconductor package structure, comprising:
disposing a first semiconductor device on an interposer substrate;
disposing the interposer substrate on a carrier substrate, wherein the interposer substrate is disposed between the carrier substrate and the first semiconductor device;
applying a thermal interface material on the first semiconductor device; and
attaching a lid on the carrier substrate to cover the first semiconductor device, wherein the lid includes a lower surface having a first recess facing the first semiconductor device and a second recess in the first recess, and a portion of the thermal interface material is accommodated in the first recess and the second recess, wherein the second recess is surrounded by the first recess in a top view, and the first semiconductor device overlaps the first recess and the second recess.