| CPC H01L 22/34 (2013.01) [G11C 16/0483 (2013.01); G11C 16/08 (2013.01); G11C 16/26 (2013.01); G11C 29/14 (2013.01); H01L 22/20 (2013.01); H01L 23/528 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H03K 3/0315 (2013.01); H10B 41/27 (2023.02); H10B 41/40 (2023.02); H10B 43/27 (2023.02); H10B 43/40 (2023.02); H01L 24/49 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49176 (2013.01)] | 20 Claims |

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1. An apparatus comprising:
a die of a memory device;
a memory cell portion located over a first portion of the die;
a conductive pad portion located over a second portion of the die and outside the memory cell portion, the conductive pad portion including conductive pads, each of the conductive pads being part of a respective electrical path coupled to a conductive contact; and
a sensor circuit located directly over the second portion of the die and under the conductive pad portion, the sensor circuit including:
a first ring oscillator;
a second ring oscillator;
a selector coupled to outputs of the first and second oscillators; and
an output unit coupled to an output of the selector.
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