US 12,362,237 B1
Fill-in planarization system and method
Simon Bubel, Carrboro, NC (US); and Alexander Kevin Shveyd, Chapel Hill, NC (US)
Assigned to WOLFSPEED, INC., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on Apr. 5, 2024, as Appl. No. 18/628,231.
Int. Cl. H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01)
CPC H01L 21/76879 (2013.01) [H01L 21/02529 (2013.01); H01L 21/02675 (2013.01); H01L 21/304 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a semiconductor workpiece having a surface, the semiconductor workpiece comprising silicon carbide;
providing a filler material on at least a portion of the surface;
subsequent to providing the filler material, performing a laser-based surface processing operation on the surface, wherein the filler material has an optical property that changes an application of a laser during the laser-based surface processing operation.