US 12,362,220 B2
Method for manufacturing display device, and transfer substrate for manufacturing display device
Jungsub Kim, Seoul (KR); Yongdae Kim, Seoul (KR); and Sunghyun Moon, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 17/630,288
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Aug. 7, 2019, PCT No. PCT/KR2019/009861
§ 371(c)(1), (2) Date Jan. 26, 2022,
PCT Pub. No. WO2021/025201, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 10-2019-0095605 (KR), filed on Aug. 6, 2019.
Prior Publication US 2022/0277983 A1, Sep. 1, 2022
Int. Cl. H01L 21/683 (2006.01); G03F 7/00 (2006.01)
CPC H01L 21/6835 (2013.01) [G03F 7/0002 (2013.01); H01L 2221/68354 (2013.01)] 18 Claims
OG exemplary drawing
 
15. A transfer substrate used in fabricating a display device based on a semiconductor light emitting element, the transfer substrate comprising:
a base layer;
an organic stamp layer located on the base layer and having a plurality of protrusions; and
inorganic fillers dispersed in the organic stamp layer,
wherein a concentration of the inorganic fillers gradually decreases within the organic stamp layer in a direction from the base layer to the plurality of protrusions,
wherein the plurality of protrusions includes:
a first region in which the inorganic fillers are dispersed; and
a second region which is substantially free of the inorganic fillers.