US 12,362,217 B2
Electrostatic chuck and semiconductor processing apparatus
Jian Liu, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Filed on Apr. 28, 2023, as Appl. No. 18/309,227.
Application 18/309,227 is a continuation of application No. PCT/CN2021/125979, filed on Oct. 25, 2021.
Claims priority of application No. 202011170370.1 (CN), filed on Oct. 28, 2020.
Prior Publication US 2023/0260817 A1, Aug. 17, 2023
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck arranged in a process chamber of a semiconductor processing apparatus, comprising:
an insulation layer for carrying a wafer; and
an electrode assembly arranged in the insulation layer, including:
an adsorption electrode including a first electrode and a second electrode arranged at intervals; and
a distribution electrode including a first distribution electrode electrically connected to the first electrode and a second distribution electrode electrically connected to the second electrode;
wherein:
the electrode assembly is electrically connected to a direct current (DC) power supply and a radio frequency (RF) power supply;
in response to the DC power supply applying DC power to the electrode assembly, the electrode assembly is used to adsorb the wafer on the insulation layer; and
in response to the RF power supply applying RF power to the electrode assembly, the RF power is uniformly distributed to different positions of the insulation layer.