US 12,362,212 B2
Computer-readable recording medium, substrate bonding system, and substrate bonding method
Keiichi Saiki, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Mar. 9, 2023, as Appl. No. 18/180,995.
Claims priority of application No. 2022-037477 (JP), filed on Mar. 10, 2022.
Prior Publication US 2023/0290659 A1, Sep. 14, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67288 (2013.01) [H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/6704 (2013.01); H01L 21/67207 (2013.01); H01L 21/6838 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate bonding method, comprising:
holding substrates by a lower chuck and an upper chuck disposed apart from each other in a vertical direction;
acquiring displacement data of multiple points on a surface of the substrate held by the lower chuck;
specifying a distribution of displacements on the surface based on the acquired displacement data;
determining types of a foreign matter based on the specified distribution; and
bonding, when there exists no foreign matter, the substrates respectively held by the lower chuck and the upper chuck,
wherein the types of the foreign matter include one abnormality regarding the foreign matter existing between the substrate and the chuck, and another abnormality distinct from the foreign matter between the substrate and the chuck, and
wherein the determining the types of the foreign matter includes determining, when the distribution is similar to a Gaussian distribution, that the foreign matter exists between the substrate and the chuck.